FAQ
Frequently asked questions
Welcome to our FAQ page! Here you will find answers to the most frequently asked questions about the services and products of Schambeck Elektronik GmbH. From technical details to our services in Nuremberg and other locations – we have compiled the most important information for you. If you have any further questions, please do not hesitate to contact us directly.
FREQUENTLY ASKED QUESTIONS
FAQ
AOI is an inspection process that uses high-resolution cameras and image processing software to check printed circuit boards for defects such as missing or incorrectly positioned components.
An assembly of electronic components and connections that are soldered to a printed circuit board and together fulfill one or more specific functions.
The process of placing and soldering electronic components on a printed circuit board.
A design for integrated circuits (ICs) in which the connections are arranged in the form of a grid of solder balls on the underside of the housing. BGAs offer a higher connection density and improved electrical performance compared to other housing types.
BGA Re-Work is a process for repairing printed circuit boards in which defective or incorrect ball grid array (BGA) components are removed and replaced with new ones. Special hot air stations or infrared soldering stations are used to loosen and restore the soldered connections.
Lead-free soldering uses alternative alloys such as tin-silver-copper instead of lead to comply with environmental regulations.
Bill of materials that lists all components and materials required for the manufacture of a product or assembly.
Box build refers to the complete system integration, including the assembly and integration of PCBs, housings and other components.
Conformal coating is a protective layer that is applied to electronic assemblies to protect them from environmental influences.
DFM is a concept for optimizing the design in order to reduce manufacturing costs and improve quality.
We can process the data formats Eagle, Target and KiCad. However, you are also welcome to send us the layout of the circuit board in the form of a PDF file.
Press-fit technology is a connection technique in which a contact pin with a specific geometry is pressed into a metallized hole in a printed circuit board. This creates a mechanically strong and electrically conductive connection without additional solder or flux. The press-fit technology is suitable for high current loads and offers high reliability and ease of maintenance. It is usually used where conventional soldering is not possible due to the mass of the PCB (see multilayer)
Measures and materials to protect sensitive electronic components from electrostatic discharge.
a term that refers to electronic components with very small connection distances, such as micro BGA, LGA or closely spaced connectors.
A test method in which movable probes are used to test electrical connections on printed circuit boards.
This test checks the functionality of electronic devices or assemblies under various conditions.
With the help of a semi-automatic machine, it is possible to apply the solder paste to the circuit board by hand, which means that a stencil may not be necessary for prototypes. In addition, SMD components can be assembled by hand from a belt section.
Test procedure for checking the electrical functionality of printed circuit boards.
Solder paste is a mixture of fine solder particles and flux that is applied to printed circuit boards to fix electronic components during the soldering process.
A solder paste printer is a device that applies solder paste to a printed circuit board. The solder paste consists of small solder balls that are bound in a flux. The solder paste printer uses a squeegee to press the solder paste through a stencil that reproduces the layout of the PCB. The solder paste adheres to the intended points and forms the basis for the subsequent solder connection.
A multilayer is a printed circuit board consisting of several superimposed layers of conductive tracks and insulating materials. A multilayer enables a high packing density, high complexity and high performance of the electronic circuits. At VIERLING we can process up to 32-layer multilayers.
The NPI process covers the introduction of new products into production, from development to series production.
The reflow oven solders the SMD components onto a circuit board by gently melting the previously applied solder paste using different heat zones. This also activates the flux. The circuit board and the components are heated as evenly as possible.
An inspection method that uses X-rays to check the internal structures of printed circuit boards and solder connections.
A printing process in which solder paste is precisely applied to the PCB pads using a squeegee through recesses in a stencil before the electronic components are placed in the SMT line.
A soldering system that enables the high-precision and spot soldering of a wide variety of THT components. It does not matter whether SMD components are already placed near the soldering points and the quality of the soldering is consistently high.
Electronic components designed for surface mounting using surface mount technology (SMT).
Process in which electronic components are soldered directly to the surface of a printed circuit board without wire connections. “SMD” stands for “Surface Mounted Device”.
A method of mounting electronic components directly onto the surface of a printed circuit board.
Devices that are specially made to connect a printed circuit board to test equipment during the test.
An assembly technique in which electronic components with wire connections are inserted through holes in the circuit board and soldered on the opposite side.
Tests that check the resistance of electronic components and assemblies under various environmental conditions such as temperature, humidity and vibration.
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